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about

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About ICAMM 2027

The 7th International Conference on Advanced Materials and Mechatronics (ICAMM 2027) is scheduled to take place in Chongqing, China from May 21-23, 2027. We cordially invite experts, scholars, scientific and technological professionals, as well as graduate students specializing in the field of materials and mechatronics from both domestic and international backgrounds to submit their research papers and actively participate in this conference.

Nowadays, the research and development level as well as the industrialization scale of advanced materials have become crucial indicators for measuring a country or region's economic and social development, scientific and technological progress, and national defense capabilities. In comparison to traditional mechanical manufacturing, composite mechanical and electronic engineering, along with its integration of artificial intelligence technology, offer even greater potential applications that can effectively meet the demands of increasingly complex industrial production and manufacturing in this era of highly developed industrial capacity. The integration of advanced materials with mechanical and electronic systems, along with the mutual promotion and dissemination of relevant research findings, significantly impact the development of various fields in China. This holds immense significance in accelerating social advancement and transformation while seizing the commanding heights of a new wave of scientific and technological revolution. The objective of this conference is to establish a communication bridge for experts, scholars, and professionals from diverse backgrounds within the materials and electromechanical field, facilitating and promoting interdisciplinary intersectionality.

date

Important Dates

Full Paper Submission Date: March 15, 2027

Notification of Acceptance: April 23, 2027

Registration Deadline: April 8, 2027

Conference Dates: May 21-23, 2027

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Call for Papers

The topics of interest for submission include, but are not limited to:

📚︎Topics

· Mechanics of materials

· Optical/electronic/magnetic materials

· Advanced electromagnetism

· Laser Physics and Technology

· Study on high-speed signal interconnection and its physical mechanism

· Irradiation electronics

· Material forming process and equipment

· Semiconductor materials

· Electronic materials

· Micro/nanomaterials

· Smart Materials and Adaptive Structures 

· Nanoelectronic Devices and Nanomanufacturing Technology 

· New Energy Materials and Energy Storage Technology (e.g., lithium batteries, fuel cell materials) 

· Composite Materials and Their Mechanical Properties 

· Material Surface Modification and Thin Film Technology 

· Mechatronic System Design and Integration Technology 

· Sensor Technology and Microelectromechanical Systems (MEMS)

· High-Temperature Materials and High-Performance Structural Materials

· Metamaterials and Their Applications

· Multifunctional Materials and Devices

· Computational Materials Science and Materials Genome Engineering

· Brittle Fracture and Material Fatigue

· Quantum Materials and Quantum Devices

Publication

Publication

All accepted full papers will be published in the conference proceedings and will be submitted to EI Compendex / Scopus  for indexing.


ICAMM 2025

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📚︎Ei Compendex

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📚︎Scopus


ICAMM 2024

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📚︎Ei Compendex

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📚︎Scopus


ICAMM 2023

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📚︎Ei Compendex

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📚︎Scopus


ICAMM 2022

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📚︎Ei Compendex

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📚︎Scopus


ICAMM 2021

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📚︎Ei Compendex

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📚︎Scopus


Note: All submitted articles should report original research results, experimental or theoretical, not previously published or under consideration for publication elsewhere. Articles submitted to the conference should meet these criteria. We firmly believe that ethical conduct is the most essential virtue of academics. Hence, any act of plagiarism or other misconduct is totally unacceptable and cannot be tolerated.

contact

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Contact Us

Conference Secretary: Miss. Pan

Tel: +86-18922107265 (WeChat)

E-Mail: pansiyuan@ais.cn

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If you have any questions or inquiries, please feel free to contact us.

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